Semiconductor Cutting Abrasive
Semiconductor Cutting Abrasive: After two smashing technology together, it not only has the high-hardness of green silicon carbide, but also has the flexibility of black silicon carbide. It has high Cutting yield, concentrated particle size, low standard deviation and the chemical properties like isoelectric point, PH also can meet the standard, in structure, It has high purity, high chemical purity, high hardness, high front degrees, high level of SD and circular degree index.
admin 2009-5-15 10:11:03